New three-dimensional wafer bonding technology using the adhesive injection method

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 3 SUPPL. B, 1998, Pages 1217-1221

  Matsumoto, Takuji ^a   Satoh, Masakazu ^a   Sakuma, Katsuyuki ^a   Kurino, Hiroyuki ^a   Miyakawa, Nobuaki ^b   Itani, Hikotaro ^c   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b XEROX CORPORATION   (United States)

^c MITSUBISHI HEAVY INDUSTRIES LTD   (Japan)

Author keywords

3D wafer bonding technology; Adhesive injection method; Buried interconnection; Chemical mechanical polishing; Wafer alignment

Indexed keywords

EID: 0005641218     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.1217     Document Type: Article

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