Characterization of low-temperature wafer bonding using thin-film parylene

Journal of Microelectromechanical Systems

Volumn 14, Issue 6, 2005, Pages 1347-1355

  Kim, Hanseup ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Low temperature wafer bonding; Parylene; Polymer bonding

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; CHARACTERIZATION; CHEMICAL ANALYSIS; ELECTRONICS PACKAGING; LOW TEMPERATURE EFFECTS; MICROACTUATORS; ORGANIC POLYMERS; PRESSURE EFFECTS; THIN FILMS;

LOW-TEMPERATURE WAFER BONDING; PARYLENE; POLYMER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 29244473558     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.859102     Document Type: Article

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