Thermal cycling effects on critical adhesion energy and residual stress in benzocyclobutene-bonded wafers

Journal of the Electrochemical Society

Volumn 152, Issue 4, 2005, Pages

  Kwon, Yongchai ^a,c   Seok, Jongwon ^b,d   Lu, Jian Qiang ^a   Cale, Timothy S ^a   Gutmann, Ronald J ^a  

^a Focus Center New York   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^c SAMSUNG Electronics   (South Korea)

^d Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BUTENES; DEPOSITION; GLASS TRANSITION; RESIDUAL STRESSES; SILICA; SUPERCONDUCTING TRANSITION TEMPERATURE;

ADHESION ENERGY; BACK-END-OF-THE-LINE (BEOL); CHEMICAL MECHANICAL PLANARIZATION (CPM); RADIO FREQUENCY;

THERMAL CYCLING;

EID: 18344373109     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1869252     Document Type: Article

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