Silicon wafer bonding through RF dielectric heating

Sensors and Actuators, A: Physical

Volumn 103, Issue 1-2, 2003, Pages 16-22

  Bayrashev, Andrey ^a   Ziaie, Babak ^a  

^a University of Minnesota   (United States)

Author keywords

Adhesive bonding; MEMS packaging; RF dielectric heating; Silicon wafer bonding

Indexed keywords

BOND STRENGTH (CHEMICAL); BONDING; DIELECTRIC HEATING; GLASS TRANSITION; HEAT TRANSFER; PHOTORESISTS;

RADIO FREQUENCY (RF) HEATING;

SILICON WAFERS;

EID: 0037439006     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00327-8     Document Type: Conference Paper

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