Design of a folded-patch chip-size antenna for short-range communications

Conference Proceedings - 33rd European Microwave Conference, EuMC 2003

Volumn 2, Issue , 2003, Pages 723-726

  Mendes, P M ^a   Polyakov, A ^a   Bartek, M ^a   Burghartz, J N ^a   Correia, J H ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

SUBSTRATES; WIRELESS TELECOMMUNICATION SYSTEMS;

ADHESIVE WAFER BONDING; ANTENNA SIZE REDUCTIONS; ON-CHIP INTEGRATION; OPERATING CHARACTERISTICS; SHORT-RANGE COMMUNICATION; SHORT-RANGE WIRELESS COMMUNICATIONS; SUBSTRATE THICKNESS; WAFER-LEVEL CHIP-SCALE PACKAGING;

ANTENNAS;

EID: 33645548701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2003.177578     Document Type: Conference Paper

References (7)

1. Kin-Lu Wong, Planar Antennas far Wireless Communications, John Wiley &Sons, Inc 2003
2. P M Mendes, M Bartek, IN Burghartz, ill Correia, Design and Analysis of a 6 0Hz Chip Antenna on Glass Substrates for Integration with RFlWireless Microsystems, IEEE APS [nt Symp , Columbus, Ohio, USA, June 22-27, 2003
3. K Polyakov, P M Mendes, SM Sinaga, M Bartok, B Rejaei, JET Correia, J N Burghartz Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages, Proc ECTC 2003, New Orleans, USA, May 27-30, 2003
4. R L Li, 0 Dciean E Tsai, E Tentzeris, J Laskar, Novel Small Folded Shorted-Patch Antennas IEEE APS tnt Symp Vol 4, pp 26-29, 2002
5. www shellcase com
6. P M Mendes, A Polyakov, Psi Bartek, J N Burghartz, J H Correia, Integrated 5 7 0Hz Chip-Size Antenna for Wireless Sensor Networks, Proc Transclucers03, Boston, USA, June 8-12, 2003, pp 49-52
7. P M Mendcs, A Polyakov, M Bartok, J N Burghartz, I H Correia, Extraction of Glass-Wafers Electrical Properties Based onS-Paramsters Msasurcments of Coplanar Waveguides, ConfTele 2003, Aveiro, Portugal, June tS-20, 2003