Rapid MEMS prototyping using SU-8, wafer bonding and deep reactive ion etching

Biennial University/Government/Industry Microelectronics Symposium - Proceedings

Volumn , Issue , 2001, Pages 158-161

  Sampath, S K ^a   Clair, St ^b   Wu, Xingtao ^a   Ivanov, D V ^a   Wang, Q ^c   Ghosh, C ^c   Farmer, K R ^c  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

^b EVI   (United States)

^c Princeton Optronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INSULATORS; PHOTORESISTS; REACTIVE ION ETCHING; SILICON WAFERS; SINGLE CRYSTALS;

WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0035164005     PISSN: 07496877     EISSN: None     Source Type: Journal    
DOI: 10.1109/UGIM.2001.960320     Document Type: Article

References (5)