Design rules for polyimide solvent bonding

Sensors and Materials

Volumn 11, Issue 5, 1999, Pages 269-278

  Glasgow, Ian K ^a,b   Beebe, David J ^b   White, Victor E ^c  

^a Micro Agri Systems   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Bonding; Polyimide

Indexed keywords

EID: 0033474579     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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