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Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 415-418

Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging

(3) Kim, Jongbaeg a Chiao, Mu a Lin, Liwei a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; GOLD; HERMETIC SEALS; LOW TEMPERATURE EFFECTS; PACKAGING; PACKAGING MATERIALS; SEMICONDUCTING INDIUM; ULTRASONIC APPLICATIONS; VIBRATIONS (MECHANICAL);

LOW TEMPERATURE BONDING; ULTRASONIC BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036122188 PISSN: 10846999 EISSN: None Source Type: Journal
DOI: 10.1109/MEMSYS.2002.984291 Document Type: Article

Times cited : (38)

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3
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4
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5
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6
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.