A method to maintain wafer alignment precision during adhesive wafer bonding

Sensors and Actuators, A: Physical

Volumn 107, Issue 3, 2003, Pages 273-278

  Niklaus, Frank ^a   Enoksson, Peter ^a   Kälvesten, Edvard ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesive bonding; Alignment; Polymer bonding; Wafer alignment; Wafer bond equipment; Wafer bonding

Indexed keywords

ADHESIVES; BONDING; CROSSLINKING; FRICTION; SHEARING; THERMOSETS;

WAFER BONDING;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0242270003     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00356-X     Document Type: Article

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