Wafer-scale microdevice transfer/interconnect: From a new integration method to its application in an afm-based data-storage system

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1907-1910

  Despont, M ^a   Drechsler, U ^a   Yu, R ^b   Pogge, H B ^b   Vettiger, P ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM MICROELECTRONICS   (United States)

Author keywords

CMOS technology; Integrated circuit interconnections; Micromechanical devices; Multicore processing; Optical device fabrication; Stacking; Thermal expansion; Thermal stresses; Transducers; Wiring

Indexed keywords

ACTUATORS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; DATA STORAGE EQUIPMENT; DIGITAL STORAGE; DISTRIBUTED COMPUTER SYSTEMS; ELECTRIC WIRING; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; MICROSYSTEMS; NANOCANTILEVERS; PROGRAMMABLE LOGIC CONTROLLERS; SOLID-STATE SENSORS; SYSTEM-ON-CHIP; THERMAL EXPANSION; THERMAL STRESS; TRANSDUCERS;

CMOS TECHNOLOGY; INTEGRATED CIRCUIT INTERCONNECTIONS; MICROMECHANICAL DEVICE; MULTI-CORE PROCESSING; OPTICAL DEVICE FABRICATION; STACKING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 10944239150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217164     Document Type: Conference Paper

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