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Volumn 13, Issue 3, 2004, Pages 491-499

Photoresist coating methods for the integration of novel 3-D RF microstructures

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; INTEGRATED CIRCUIT MANUFACTURE; LITHOGRAPHY; MASKS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PHOTORESISTS; SPRAYED COATINGS; SURFACE TOPOGRAPHY;

EID: 3142731361     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.828728     Document Type: Article
Times cited : (92)

References (13)
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    • (1999) Proc. Eurosensors XIII , pp. 256-272
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  • 2
    • 0041940609 scopus 로고    scopus 로고
    • Conformal coating by photoresist of sharp corners of anisotropically etched through-hole in silicon
    • M. Heschel and S. Bouwstra, "Conformal coating by photoresist of sharp corners of anisotropically etched through-hole in silicon," Sens. Actuators, Phys. A, vol. 70, pp. 75-80, 1998.
    • (1998) Sens. Actuators, Phys. A , vol.70 , pp. 75-80
    • Heschel M. Bouwstra, S.1
  • 4
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    • Thallner GmbH, DI Erich Thallner Strasse. EV Group E., Schaerding, Austria. [Online]. Available: http://www.EVGroup.com
  • 5
    • 84907851564 scopus 로고    scopus 로고
    • IC-compatible two-level bulk micromachinign for RF silicon technology
    • Cork-Ireland, Sept. 11-13
    • N. P. Pham, P. M. Sarro, K. T. Ng, and J. N. Burghartz, "IC-compatible two-level bulk micromachinign for RF silicon technology," in Proc. 30th ESSDERC, Cork-Ireland, Sept. 11-13, 2000, pp. 204-207.
    • (2000) Proc. 30th ESSDERC , pp. 204-207
    • Pham, N.P.1    Sarro, P.M.2    Ng, K.T.3    Burghartz, J.N.4
  • 6
    • 0034542586 scopus 로고    scopus 로고
    • IC-compatible process for pattern transfer in deep wells for integration of RF components
    • Santa Clara, CA, Sept. 18-10
    • N. P. Pham, P. M. Sarro, and J. N. Burghartz, "IC-compatible process for pattern transfer in deep wells for integration of RF components," in Proc. SPIE, vol. 4174, Santa Clara, CA, Sept. 18-10, 2000, pp. 390-397.
    • (2000) Proc. SPIE , vol.4174 , pp. 390-397
    • Pham, N.P.1    Sarro, P.M.2    Burghartz, J.N.3
  • 7
    • 0029778672 scopus 로고    scopus 로고
    • Spin coating and alternative techniques for flat panel displays
    • M. Parodi, T. Batchelder, P. Haaland, and J. McKibben, "Spin coating and alternative techniques for flat panel displays," Semiconductor Int., vol. 19, no. 1, pp. 101-106, 1996.
    • (1996) Semiconductor Int. , vol.19 , Issue.1 , pp. 101-106
    • Parodi, M.1    Batchelder, T.2    Haaland, P.3    McKibben, J.4
  • 8
    • 3142665620 scopus 로고    scopus 로고
    • Clarian Corp. Clariant Corporation, Business Unit Electronic Materials, Somerville, NJ
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    • Technical Information for AZ Products
  • 10
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  • 11
    • 23544458571 scopus 로고    scopus 로고
    • RF-devices realized in MEMS by using electrodepositable photoresist
    • Veldhoven, The Netherlands, Nov
    • E. Boellaard, N. P. Pham, L. D. M. van den Brekel, and J. N. Burghartz, "RF-devices realized in MEMS by using electrodepositable photoresist," in Proc. SAFE 2001, vol. 28-29, Veldhoven, The Netherlands, Nov. 2001, pp. 1-7.
    • (2001) Proc. SAFE 2001 , vol.28-29 , pp. 1-7
    • Boellaard, E.1    Pham, N.P.2    van den Brekel, L.D.M.3    Burghartz, J.N.4
  • 12
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    • N. P. Pham, P. M. Sarro, K. T. Ng, and J. N. Burghartz, "IC-compatible two-level bulk micromachining process module for RF silicon technology," IEEE Trans. Electron. Devices, vol. 48, pp. 1756-1764, Aug. 2001.
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  • 13
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    • A micromachining post-process module for RF silicon technology
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.