Novel low temperature CMOS compatible full wafer bonding process for the fabrication of 3D embedded microchannels using SU-8

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5276, Issue , 2004, Pages 131-142

  Blanco, Francisco J ^a   Agirregabiria, Maria ^a   Tijero, Maria ^a   Berganzo, Javier ^a   Garcia, Jorge ^a   Arroyo, Maria ^a   Ruano, Jesus M ^a   Aramburu, Iñigo ^a   Mayora, Kepa ^a  

^a IK4 IKERLAN   (Spain)

Author keywords

3 D Microstructures; Embedded microchannels; SU 8 photoresist; Taguchi Tecniques; Wafer bonding

Indexed keywords

BONDING; CHANNEL CAPACITY; EMBEDDED SYSTEMS; MICROSTRUCTURE; PHOTOLITHOGRAPHY; PHOTORESISTORS; WSI CIRCUITS;

3-D MICROSTRUCTURES; EMBEDDED MICROCHANNELS; SU-8 PHOTORESISTS; TAGUCHI TECHNIQUES; WAFER BONDING;

CMOS INTEGRATED CIRCUITS;

EID: 2442562317     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.522287     Document Type: Conference Paper

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