ShellCase ultrathin chip size package

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 236-240

  Badihi, A ^a  

^a ShellCase   (Israel)

Author keywords

CSP; Manufacturing; Optical Package; Reliabiliy.; Sm; Wafir level CSP

Indexed keywords

CHIP SCALE PACKAGES; COST EFFECTIVENESS; INTERFACES (MATERIALS); MANUFACTURE; PACKAGING MATERIALS; SAMARIUM; SAMARIUM COMPOUNDS;

CHIP SIZE PACKAGE; COST EFFECTIVE; ELECTRONIC PRODUCT; OPTICAL APPLICATIONS; RELIABILIY; ULTRA-THIN CHIPS; WAFER LEVEL PROCESS; WAFIR LEVEL CSP;

PACKAGING;

EID: 33645536545     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757319     Document Type: Conference Paper

References (2)

1. ShellPACK a Thin Chip Size, Integrated Circuit Package, Semicon West, CSP session, June 1996.
2. ShellBGA a Thin Chip Size Integrated Circuit Package, ISHM Workshop on CSP, August 1996.