Wafer bonding using dielectric polymer thin films in 3D integration

Materials Research Society Symposium - Proceedings

Volumn 710, Issue , 2002, Pages 231-236

  Kwon, Y ^a   Lu, J Q ^a   Kraft, R P ^a   McDonald, J F ^a   Gutmann, R J ^a   Cale, T S ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLUES; INTEGRATED CIRCUIT MANUFACTURE; MONOLITHIC INTEGRATED CIRCUITS; POLISHING; SEMICONDUCTING GLASS; SEMICONDUCTING POLYMERS; SILICON WAFERS; THERMAL CYCLING; THERMODYNAMIC STABILITY; WSI CIRCUITS;

BACKSIDE GRINDING; BONDING GLUES; GLASS WAFERS; POLYMER THIN FILMS; RAZOR BLADE METHOD; THREE DIMENSIONAL INTEGRATION; WAFER BONDING;

THIN FILMS;

EID: 0036963601     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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