Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints

Materials Science and Engineering: A

Volumn 371, Issue 1-2, 2004, Pages 267-276

  Kim, Jong Woong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

BGA; Finite element analysis; Shear test; Sn 3.5Ag; Sn 3.5Ag 0.75Cu; Solder

Indexed keywords

ELASTICITY; ELECTROLYSIS; ENERGY DISPERSIVE SPECTROSCOPY; FINITE ELEMENT METHOD; FRACTURE; INTERMETALLICS; MATHEMATICAL MODELS; STRAIN; STRESSES; TIN ALLOYS; VISCOPLASTICITY;

ELECTRON PROBE MICROANALYSIS (EPMA); ENERGY DENSITY DISTRIBUTION; SHEAR FORCES;

SOLDERED JOINTS;

FAILURE ANALYSIS; SOLDER;

EID: 16544377116     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.12.012     Document Type: Article

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