Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints

Journal of Electronic Materials

Volumn 34, Issue 2, 2005, Pages 188-195

  Shin, S W ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Creep; Lap shear; Lead free solders

Indexed keywords

BISMUTH ALLOYS; BRITTLENESS; COPPER ALLOYS; CREEP; DEFORMATION; ETCHING; EUTECTICS; SOLDERED JOINTS; THERMAL CYCLING;

GRAIN BOUNDARY SLIDING (GBS); LAP SHEAR; LEAD-FREE SOLDERS; THERMAL FATIGUE;

TIN COMPOUNDS;

EID: 14644388773     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0232-0     Document Type: Article

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