Aging characteristics of Sn-Ag eutectic solder alloy with the addition of Cu, In, and Mn

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 40, Issue 10, 2009, Pages 2369-2376

  Ghosh, M ^a   Kar, Abhijit ^b,c   Das, S K ^a   Ray, A K ^a  

^a NATIONAL METALLURGICAL LABORATORY   (India)

^b Sungkyunkwan University   (South Korea)

^c SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

AGING CHARACTERISTICS; AGING TIME; CU SUBSTRATE; DIFFUSION ZONES; EUTECTIC SOLDERS; JOINT INTERFACES; REACTION LAYERS; SMALL REDUCTION; SN-AG-CU; SOLDER ALLOYS; TRANSITION JOINTS;

ALLOYS; COPPER ALLOYS; MANGANESE; MANGANESE COMPOUNDS; MICROSTRUCTURE; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 69949160333     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-9948-4     Document Type: Article

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