Microstructure and growth behavior of Cu6Sn5 for Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 19, Issue 4, 2009, Pages 708-713

  Wang, Yao Li ^a,b   Zhang, Ke Ke ^a,b   Han, Li Juan ^a   Wen, Hong Hong ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HENAN KEY LABORATORY OF ADVANCED NON FERROUS METALS   (China)

Author keywords

Aging; Cu6 Sn5; Growing dynamics; Microstructure; Sn 2.5Ag 0.7Cu(0.1 RE) solder alloy; Soldering

Indexed keywords

AGING; AGING TIME; CU6 SN5; ELECTRONIC MICROSCOPES; ENERGY SPECTRUM ANALYSIS; GROWING DYNAMICS; GROWTH BEHAVIORS; INTERMETALLIC COMPOUNDS; SN-2.5AG-0.7CU(0.1 RE) SOLDER ALLOY; SOLDER JOINTS; X- RAY DIFFRACTIONS;

ALLOYS; BRAZING; COPPER ALLOYS; DIFFRACTION; DYNAMICS; LIGHT; MICROSTRUCTURE; RARE EARTH ELEMENTS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SPECTRUM ANALYSIS; SPECTRUM ANALYZERS; TIN ALLOYS; WELDING; X RAY DIFFRACTION ANALYSIS;

TIN;

EID: 65549157663     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

1. Zhang Ke-Ke, Wang Yao-Li, Fan Yan-Li, Zhu Yao-Min, Zhang Xin, Yan Yan-Fu. Effect of Ce-La mixed rare earth content and environment condition on the creep rupture life of Sn-Ag-Cu solder joints[J]. Rare Metal Materials and Engineering, 2007, 36(8): 1473-1476.
2. Fan Yan-Li, Zhang Ke-Ke, Wang Shuang-Qi, Cheng Guang-Hui, Wang Yao-Li, Yu Yang-Chun. Wettability of Sn-Ag-Cu lead-free solder containing low Ag for different substrate with water-soluble flux[J]. Special Casting & Nonferrous Alloys, 2006, 26(9): 604-606.
3. Xu Tian-Han, Zhao Mai-Qun, Zhao Xin-Hua. Study on the optimal free-lead solder alloy of Sn-Ag-Cu system[J]. Electronic Components & Materials, 2004, 23(8): 14-21.
4. Zhang Ke-Ke, Wang Shuang-Qi, Yu Yang-Chun, Wang Yao-Li, Fan Yan-Li. Wetting match performance of Sn-Ag-Cu-RE lead-free solder for surface mount component[J]. The Chinese Journal of Nonferrous Metals, 2006, 16(11): 1908-1912.
5. Yan Yan-Fu, Feng Li-Fang, Zhang Ke-Ke, Wen Jiu-Ba. Influence of temperature on creep behavior of Ag particle enhancement Sn-Cu based composite solder[J]. Tsinghua Science and Technology, 2007, 12(3): 296-301.
6. Ahat S, Du Li-Guang, Sun Zhi-Guo, Sheng Mei, Luo Le. Effects of aging and thermal cycling on the microstructure and shear strength of Sn-Ag-Cu surface mount solder joint[J]. Acta Metallrugica Sinica, 2001, 37(4): 439-444.
7. Guo F, Lucas J P, Subramanlian K N. Creep behavior in Cu and Ag particles-reinforced composite and eutectic Sn3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints [J]. Journal of Materials Science, 2001, 12: 27-35.
8. Song H G, Morris J W, Hua F. The creep properties of lead-free solder joints[J]. Journal of Minerals, Metals and Materials, 2002, 6: 30-32.
9. Wang Yin-Hui, Nisida K, Hutter M. Surface activation process of lead-free solder bumps for low temperature bonding[C]// 2005 6th International Conference On Electronics Packing Technology, Shenzhen: China Electronics Packing Society, 2005: 404-407.
10. Suganuma K. Welding Technology of Lead-free Solder [M]. NING Xiao-shan, transl. Beijing: Beijing Science Press, 2004: 62-66.
11. Yoon J W, Jung S B. Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate[J]. Journal of Materials Science, 2004, 39(13): 4211-4217.
12. Vianco P T, Rejent J A, Hlava P F. Solid-state intermetallic compound layer growth between copper and Sn-3.9Ag-0.6Cu solder[J]. Journal of Electronic Materials, 2004, 33(9): 990-1004.
13. Zhang Ke-Ke, Wang Yao-Li, Fan Yan-Li, Yang Jie, Yan Yan-Fu, Zhang Xin. Research on creep properties of Sn-2.5Ag-0.7Cu-XRE lead-free-soldered joints for surface mount technology [J]. Key Engineering Materials, 2007: 353-358.
14. Wang Ye, Huang Ji-Hua, Zhang Jian-Gang, Qi Li-Hua. Microstructure of Sn-3.5Ag-0.5Cu/Cu interface[J]. The Chinese Journal of Nonferrous Metals, 2006, 16(11): 495-499.
15. Ma D, Wang W D, Lahiri S K. Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow[J]. Journal of Applied Physics, 2002, 91(5): 3312-3315.
16. Yue Yi-Xin, Tan Cheng-Yu, Zheng Zi-Qiao, Li Shi-Chen, Ye Jian-Jun. Properties and interface microstructure of new type Ag-Cu-Ge solder [J]. The Chinese Journal of Nonferrous Metals, 2006, 16(10): 1793-1798.