Impression creep characterization of rapidly cooled Sn-3.5Ag solders

Materials Science and Engineering: A

Volumn 379, Issue 1-2, 2004, Pages 401-410

  Dutta, I ^a   Park, C ^a   Choi, S ^a  

^a Naval Postgraduate School ^*  (United States)

Author keywords

Impression creep; Lead free solder; Mechanism; Sn Ag

Indexed keywords

COMPOSITION; CONCENTRATION (PROCESS); CREEP; CREEP TESTING; MICROELECTRONICS; MICROSTRUCTURE; SOLDERING ALLOYS; STRESSES;

LEAD-FREE SOLDERS; MICROELECTRONIC PACKAGES;

MATERIALS SCIENCE;

COOLING; CREEP; SOLDER;

EID: 3242724369     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.03.023     Document Type: Article

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