A study of nanoparticles in Sn-Ag based lead free solders

Microelectronics Reliability

Volumn 48, Issue 1, 2008, Pages 1-16

  Amagai, Masazumi ^a  

^a Texas Instruments Japan Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; NANOPARTICLES; SOLDERING ALLOYS; THERMAL AGING;

INTERMETALLIC COMPOUND FRACTURES; LEAD FREE SOLDERS; SOLDER HARDNESS;

TIN COMPOUNDS;

EID: 39149119686     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.05.004     Document Type: Article

References (21)

1. Arulvanan P., Zhong Z., and Shi X. Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelecton Reliab 46 2-4 (2006) 432-439
2. Wiese S., and Wolter K.-J. Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectron Reliab 44 12 (2004) 1923-1931
3. Nurmi S., Sundelin J., Ristolainen E., and Lepistö T. The effect of solder paste composition on the reliability of SnAgCu joints. Microelectron Reliab 44 3 (2004) 485-494
4. Stam F.A., and Davitt E. Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. Microelectron Reliab 41 11 (2001) 1815-1822
5. Masazumi Amagai, Yoshitaka Toyoda, Takeshi Tashima. High solder joint reliability with lead free solders. In: Proceedings of the IEEE 53rd electronic components and technology conference, 2003. p. 317-22.
6. Masazumi Amagai, Yoshitaka Toyoda, Tsukasa Ohnishi, Satoru Akita. High drop test reliability: lead-free solders. In: Proceedings of the IEEE 54th electronic components and technology conference, USA. 2004. p. 1304-9.
7. Masazumi Amagai. A study of nano particles in SnAg based lead free solders. In: Proceedings of the IEEE 56th electronic components and technology conference, USA. 2006. p. 1170-90.
8. Wen Yen Y., et al. Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag. J Mater Res 21 12 (2006) 2986-2987
9. Chen S.W., et al. Electric current-induced abnormal Cu/γ-InSn4 Interfacial reaction. J Mater Res 21 12 (2006) 3065-3071
10. Davis J.A., et al. Effect of (Au, Ni)Sn4 evolution on Sn-37Pb/ENIG solder joint reliability under isothermal and temperature-cycled conditions. IEEE Trans Compon Pack Technol 30 1 (2007) 32-41
11. Yoon J.-W., and Jung S.-B. High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron Reliab 46 5-6 (2006) 905-914
12. Peng C.-T., Kuo C.-T., Chiang K.-N., Ku T., and Chang K. Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron Reliab 46 2-4 (2006) 523-534
13. Yoon J.-W., and Jung S.-B. High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron Reliab 46 5-6 (2006) 905-914
14. Arulvanan P., Zhong Z., and Shi X. Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectron Reliab 46 2-4 (2006) 432-439
15. Varghese J., and Dasgupta A. Test methodology for durability estimation of surface mount interconnects under drop testing conditions. Microelectron Reliab 47 1 (2007) 93-103
16. Chong D.Y.R., Che F.X., Pang J.H.L., Ng K., Tan J.Y.N., and Low P.T.H. Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron Reliab 46 7 (2006) 1160-1171
17. Yeh C.-L., and Lai Y.-S. Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectron Reliab 46 5-6 (2006) 885-895
18. Peng C.-T., Kuo C.-T., Chiang K.-N., Ku T., and Chang K. Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron Reliab 46 2-4 (2006) 523-534
19. JEDEC Standard JESD22-B104-B. Mechanical shock. 2001.
20. JEDEC Standard JESD22-B111. Board level drop test method of component for handheld electronic products. 2001.
21. Kim K.S., Ryu K.W., Yu C.H., and Kim J.M. The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectron Reliab 45 3-4 (2005) 647-655