Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Journal of Electronic Materials

Volumn 33, Issue 9, 2004, Pages 1048-1054

  Lee, Hwa Teng ^a   Chen, Ming Hung ^a   Jao, Huei Mei ^a   Hsu, Chin Jui ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Adhesive strength; Intermetallic compound; Microstructure; Sn Ag Sb solder; Solidus and liquidus temperature; Thermal storage

Indexed keywords

ACTIVATION ENERGY; ANTIMONY; EUTECTICS; HEAT RESISTANCE; INTERMETALLICS; MICROSTRUCTURE; TIN ALLOYS;

ADHESIVE STRENGTH; HOT DIPPING; THERMAL STORAGE;

SOLDERED JOINTS;

EID: 4944238663     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0034-9     Document Type: Article

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