Effects of cerium on microstructure and properties of SnAgCu solders

Zhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Society

Volumn 27, Issue 2, 2009, Pages 246-250

  Zhang, Liang ^a   Xue, Songbai ^a   Zeng, Guang ^a   Gao, Lili ^a   Chen, Yan ^b   Sheng, Zhong ^a   Yu, Shenglin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Cerium; Fatigue life; Intermetallic compounds; Lead free solder; Tensile strength; Wettability

Indexed keywords

EID: 65749098591     PISSN: 10004343     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (32)

1. Nurmi S, Sundelin J, Ristolainen, Lepisto T. The effect of solder paste composition on the reliability of SnAgCu joints[J]. Microelectronics Reliability, 2004, 44(3): 485.
2. Pang J H L, Low T H, Xiong B S, Xu L H, Neo C C. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength[J]. Thin Solid Films, 2004, 462-463(9): 370.
3. Zhang Liang, Xue Songbai, Han Zongjie, Wang Jianxin, Gao Lili, Sheng Zhong. Mechanical properties of fine pitch devices soldered joints based on creep model[J]. Chinese Journal of Mechanical Engineering, 2008, 21(6): 82.
4. Vandevelde B, Gonzalez M, Limaye P, Ratchev P, Beyne E. Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages[J]. Microelectronics Reliability, 2007, 47(2-3): 259.
5. Xue Songbai, Wu Yuxiu, Han Zongjie, Wang Jianxin. Effects of lead widths and pitches on reliability of quad flat package (QFP) soldered joints[J]. Chinese Journal of Mechanical Engineering, 2007, 20(4): 40.
6. Chen Z G, Shi Y W, Xia Z D, Yan Y F. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints[J]. Journal of Electronic Materials, 2002, 31(10): 1122.
7. Chen Z G, Shi Y W, Xia Z D. Constitutive relations on creep for SnAgCuRE lead-free solder joints[J]. Journal of Electronic Materials, 2004, 33(9): 964.
8. Shi Y W, Tian J, Hao H, Xia Z D, Lei Y P, Guo F. Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. Journal of Alloys and Compounds, 2008, 453(1-2): 180.
9. Hao H, Shi Y W, Xia Z D, Lei Y P, Guo F. Microstructure evolution of SnAgCuEr lead-free solders under high temperature aging[J]. Journal of Electronic Materials, 2008, 37(1): 2.
10. Li G Y, Shi X Q. Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints[J]. Transactions of Nonferrous Metals Society of China, 2006, 16(S2): 739.
11. Wu B Y, Chan Y C, Alam M O. Electrochemical corrosion study of Pb-free solders[J]. Journal of Materials Research, 2006, 21(1): 62.
12. Mattila T T, Kaloinen E, Syed A, Kivilahti J K. Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock[A]. 57 th Electronic Components and Technology Conference[C]. 2007.
13. Gao F, Takemoto T, Nishikawa H. Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing[J]. Materials Science and Engineering: A, 2006, 40(1-2): 39.
14. 3 Sn at the interface[A]. International Microsystems, Packaging, Assembly and Circuits Technology[C]. 2007. 280.
15. Cho M G, Kang S K, Shih D Y, Lee H M. Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates[J]. Journal of Electronic Materials, 2007, 36(11): 1501.
16. Liu W P, Lee N C. The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints[J]. Journal of the Minerals, Metals and Materials Society, 2007, 59(7): 26.
17. Kim K S, Huh S H, Suganuma K. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu[J]. Microelectronics Reliability, 2003, 43(2): 259.
18. Gao Q, Zhao M, Wang H F. SMT solder joint's semi-experimental fatigue model[J]. Mechanics Research Communications, 2005, 32(3): 351.
19. Hu Yongfang, Xue Songbai, Wu Yuxiu. FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling[J]. Transactions of Nonferrous Metals Society of China, 15(S3): 317.
20. Zhang Liang, Xue Songbai, Lu Fangyan, Han Zongjie, Wang Jianxin. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads[J]. China Welding, 2008, 17(2): 37.
21. Ma X, Qian Y Y, Yoshida F. Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability[J]. Journal of Alloys and Compounds, 2002, 334(1): 224.
22. Ma X, Wang F J, Qian Y Y, Yoshida F. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface[J]. Materials Letters, 2003, 57(22-23): 3361.