Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn-Ag solder during solidification

Intermetallics

Volumn 16, Issue 9, 2008, Pages 1142-1148

  Shen, J ^a   Chan, Y C ^a   Liu, S Y ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

A. Intermetallics, miscellaneous; B. Thermal properties; C. Crystal growth; D. Microstructure

Indexed keywords

SILVER; THERMOANALYSIS;

A. INTERMETALLICS, MISCELLANEOUS; B. THERMAL PROPERTIES; C. CRYSTAL GROWTH; D. MICROSTRUCTURE; GROWTH MECHANISMS; THERMAL ANALYSIS;

MECHANISMS;

EID: 50249109433     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2008.06.016     Document Type: Article

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