Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 247-258

  Chae, Seung Hyun ^a   Zhang, Xuefeng ^a   Lu, Kuan Hsun ^a   Chao, Huang Lin ^a   Ho, Paul S ^a   Ding, Min ^b   Su, Peng ^b   Uehling, Trent ^b   Ramanathan, Lakshmi N ^b  

^a The University of Texas at Austin   (United States)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COPPER ALLOYS; ELECTROMIGRATION; FINITE ELEMENT METHOD; NICKEL ALLOYS; SEMICONDUCTING INTERMETALLICS; STATISTICS;

DAMAGE EVOLUTION; ELECTROMIGRATION STATISTICS; UNDER-BUMP METALLIZATIONS;

SOLDERED JOINTS;

EID: 33845703256     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9026-2     Document Type: Article

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