Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead-free solder alloy

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 830-840

  Pang, John H L ^a   Xiong, B S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

95.5Sn 3.8Ag 0.7Cu; Creep; Lead free solder; Solder joint; Tensile properties

Indexed keywords

CREEP TESTING; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; TENSILE PROPERTIES; TENSILE TESTING; THERMAL EFFECTS;

BULK SOLDER MICROSTRUCTURE; BULK SOLDER SPECIMEN; LEAD-FREE SOLDER ALLOY; SOLDER JOINT MICROSTRUCTURE; SOLDER JOINT SPECIMEN;

TIN ALLOYS;

EID: 29244460091     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848587     Document Type: Article

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