Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering

Applied Physics Letters

Volumn 92, Issue 9, 2008, Pages

  Kim, J Y ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; ELECTROPLATING; INTERFACES (MATERIALS); SOLDERING;

KIRKENDALL EFFECT; VOID NUCLEATION;

IMPURITIES;

EID: 40549103469     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2890072     Document Type: Article

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