Intermetallics evolution in Sn-3.5Ag based lead-free solder matrix on an OSP Cu finish

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1630-1634

  Gao, Feng ^a   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Additive; Ag 3Sn; Lead free solder; Nanoindentation; Sn 3.5Ag

Indexed keywords

ISOTHERMAL AGING; ORGANIC SOLDERABILITY PRESERVATIVE (OSP); SOLDER MATRIX;

ADDITIVES; COPPER; MICROHARDNESS; MICROSTRUCTURE; NANOINDENTATION; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

INTERMETALLICS;

EID: 36148943169     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0243-0     Document Type: Article

References (11)

1. S.K. Kang, P. Lauro, and D.-Y. Shih et al., Mater. Trans. 45, 695 (2004)
2. K. Zeng, and K.N. Tu, Mater. Sci. Eng. R. 38, 55 (2002)
3. Z. Mei, J. Electron. Packaging. 117, 105 (1995)
4. S.-W. Chen, C.-C. Lin, and C.-M. Chen, Metall. Mater. Trans. A. 29, 1965 (1998)
5. K.W. Moon, W.J. Boettinger, U.R. Kitten, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000)
6. I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, R. Kainuma, and K. Ishida, J. Electron. Mater. 29, 1137 (2000)
7. K.S. Kim, S.H. Huh, and K. Suganuma, Mater. Sci. Eng. A. 333, 106 (2002)
8. D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.-K. Choi, D.-Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 17, 2775 (2002)
9. S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-L. Cho, J. Yu, and W.K. Choi, JOM 56, 34 (2004)
10. A. Ohno, and T. Motegi, J. Japan. Inst. Metals. 37, 777 (1973)
11. L. Snugovsky, D.D. Perovic, and J.W. Rutter, Powder Metall. 48, 193 (2005)