Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

Soldering and Surface Mount Technology

Volumn 22, Issue 2, 2010, Pages 30-36

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c   Sheng, Zhong ^a   Zeng, Guang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Alloys; Chemical elements and inorganic compounds; Creep; Mechanical properties of materials; Solders; Thermodynamics

Indexed keywords

CERAMIC CRUCIBLE; CREEP PROPERTIES; CREEP RUPTURE LIFE; CREEP-RUPTURE; CU ALLOY; DESIGN/METHODOLOGY/APPROACH; DRIVING FORCES; EXPERIMENTAL DATA; GLASS RODS; IMC LAYER; INTERMETALLIC COMPOUNDS; LIQUID SOLDERS; MATRIX; MECHANICAL PROPERTIES OF MATERIALS; MECHANICAL STIRRING; PURE SN; SN-AG ALLOYS; SN-AG-CU; SN-AG-CU ALLOY; SN-AG-CU LEAD-FREE SOLDERS; SNAGCU SOLDER; SOLDER ALLOYS; SOLDERS; THERMO DYNAMIC ANALYSIS; THERMODYNAMIC METHODS;

ALLOYS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; CHEMICAL ELEMENTS; CHEMICALS; COPPER ALLOYS; CREEP; CREEP TESTING; INORGANIC COMPOUNDS; LEAD; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MICROSTRUCTURE; RARE EARTHS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMOANALYSIS; THERMODYNAMICS; TIN ALLOYS;

TIN;

EID: 77951867471     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011036262     Document Type: Article

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