Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 523-530

  Lee, J G ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Effect of dwell times; Sn Ag based solders; Thermomechanical fatigue

Indexed keywords

ANISOTROPY; DEGRADATION; FATIGUE OF MATERIALS; HIGH TEMPERATURE EFFECTS; MECHANICAL PROPERTIES; SHEAR STRENGTH; SOLDERED JOINTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

COEFFICIENT OF THERMAL EXPANSION; DWELL TIMES; TIN SILVER ALLOYS;

TIN ALLOYS;

EID: 0038498832     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0137-8     Document Type: Article

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