Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 8, 2007, Pages

  Wang, Hui ^a   Xue, Songbai ^a   Chen, Wenxue ^a   Wang, Jianxin ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Alloy element; Lead free solder; Sn Zn solder; Wettability

Indexed keywords

ALLOYING ELEMENTS; PROTECTIVE ATMOSPHERES; TIN ALLOYS; WETTING; ZINC ALLOYS;

ALLOY ELEMENT; LEAD FREE SOLDER; TIN ZINC SOLDER; WETTABILITY;

SOLDERING ALLOYS;

EID: 35248879139     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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