First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder

Journal of Applied Physics

Volumn 102, Issue 5, 2007, Pages

  Yu, Chun ^a   Lu, Hao ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ADDITION REACTIONS; DIFFUSION; DOPING (ADDITIVES); ELECTROMIGRATION; ELECTRONIC STRUCTURE;

ELECTROMIGRATION RESISTANCE; FIRST NEAREST NEIGHBOR (FNN);

SOLDERING ALLOYS;

EID: 34548647591     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2777192     Document Type: Article

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