Solid-state growth kinetics of Ni3 Sn4 at the Sn-3.5Ag solderNi interface

Journal of Applied Physics

Volumn 98, Issue 12, 2005, Pages

  Alam, M O ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CROSS SECTIONS; ENERGY DISPERSIVE X RAYS; SNAG SOLDERS; SOLID-STATE AGING;

ACTIVATION ENERGY; GROWTH KINETICS; INTERFACES (MATERIALS); METALLIZING; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS; X RAYS;

NICKEL ALLOYS;

EID: 29744441385     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2149487     Document Type: Review

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