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Volumn 381, Issue 1-2, 2004, Pages 113-120

Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder

Author keywords

Crack initiation; Crack propagation; Low cycle fatigue; Sn Ag eutectic solder; Temperature effect

Indexed keywords

ACTIVATION ENERGY; DEFORMATION; DISLOCATIONS (CRYSTALS); MICROCRACKS;

EID: 4143085018     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.04.018     Document Type: Article
Times cited : (62)

References (27)
  • 7
    • 0345768980 scopus 로고    scopus 로고
    • ASTM standards, The American Society for Testings and Materials
    • ASTM standards, ASTM E606: Standard Practice for Strain-controlled Fatigue Testing, The American Society for Testings and Materials, vol. 03.01, 1998, pp. 525-539.
    • (1998) ASTM E606: Standard Practice for Strain-controlled Fatigue Testing , vol.3 , Issue.1 , pp. 525-539


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.