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Volumn 381, Issue 1-2, 2004, Pages 113-120
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Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder
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Author keywords
Crack initiation; Crack propagation; Low cycle fatigue; Sn Ag eutectic solder; Temperature effect
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Indexed keywords
ACTIVATION ENERGY;
DEFORMATION;
DISLOCATIONS (CRYSTALS);
MICROCRACKS;
COFFIN-MANSON EQUATIONS;
STRAIN-CONTROLLED SYSTEMS;
TIN ALLOYS;
FATIGUE;
SOLDER;
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EID: 4143085018
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2004.04.018 Document Type: Article |
Times cited : (62)
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References (27)
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