Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils

Journal of Applied Physics

Volumn 86, Issue 12, 1999, Pages 6746-6751

  Kim, P G ^a,b   Jang, J W ^a   Lee, T Y ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001152082     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371751     Document Type: Article

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