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Volumn 44, Issue 20, 2009, Pages 5595-5601

Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; ANODE SIDE; COMPRESSIVE AND TENSILE STRESS; CURRENT CROWDING; ELECTROMIGRATION BEHAVIOR; ELECTRONIC PACKAGING INDUSTRY; HIGH CURRENT DENSITIES; INDUCED DAMAGE; LIMITED CAPACITY; MASS MOVEMENT; NON-COMPOSITE; PARTICLE REINFORCED COMPOSITES; SERVICE ENVIRONMENT; SNAGCU SOLDER; SOLDER JOINTS; SOLDER MATRIX;

EID: 69549086224     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-009-3787-y     Document Type: Article
Times cited : (27)

References (17)
  • 6
    • 41549161030 scopus 로고    scopus 로고
    • 10.1007/s10853-007-2320-4
    • YC Lin J Zhong 2008 J Mater Sci 43 3072 10.1007/s10853-007-2320-4
    • (2008) J Mater Sci , vol.43 , pp. 3072
    • Lin, Y.C.1    Zhong, J.2
  • 11


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.