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Volumn 44, Issue 20, 2009, Pages 5595-5601
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Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints
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Author keywords
[No Author keywords available]
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Indexed keywords
AMBIENT TEMPERATURES;
ANODE SIDE;
COMPRESSIVE AND TENSILE STRESS;
CURRENT CROWDING;
ELECTROMIGRATION BEHAVIOR;
ELECTRONIC PACKAGING INDUSTRY;
HIGH CURRENT DENSITIES;
INDUCED DAMAGE;
LIMITED CAPACITY;
MASS MOVEMENT;
NON-COMPOSITE;
PARTICLE REINFORCED COMPOSITES;
SERVICE ENVIRONMENT;
SNAGCU SOLDER;
SOLDER JOINTS;
SOLDER MATRIX;
BRAZING;
ELECTROMIGRATION;
ELECTRONICS PACKAGING;
EUTECTICS;
FRACTURE MECHANICS;
PHASE INTERFACES;
SILVER;
SOLDERING ALLOYS;
WELDING;
TIN;
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EID: 69549086224
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-009-3787-y Document Type: Article |
Times cited : (27)
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References (17)
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