Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints

Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 1, 2001, Pages 27-35

  Guo, F ^a   Lucas, J P ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPOSITE MATERIALS; EUTECTICS; EXCIMER LASERS; LASER ABLATION; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE;

PARTICLE-REINFORCED COMPOSITES;

CREEP TESTING;

EID: 0035008111     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011264527894     Document Type: Article

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