Reliability of CBGA soldered joint under thermal cycling

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 26, Issue 10, 2005, Pages 81-83

  Xue, Song Bai ^a   Hu, Yong Fang ^a   Yu, Sheng Lin ^b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

BGA; Crack; Thermal cycling; Thermal fatigue life

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; CRACKS; CREEP; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); OPTICAL MICROSCOPY; RELIABILITY; STRESS CONCENTRATION; THERMAL CYCLING;

CERAMIC BALL GRID ARRAY (CBGA); THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 29244466507     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)