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Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 4, 2008, Pages 383-388

Size effects in small scaled lead-free solder joints

(5) Zimprich, Peter a Betzwar Kotas, A a Khatibi, G a Weiss, B a Ipser, H a

a UNIVERSITY OF VIENNA (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZED JOINTS; SOLDER INTERCONNECT;

CRACK PROPAGATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; MICROELECTRONICS; SIZE DISTRIBUTION; STRAIN; TENSILE STRENGTH;

SOLDERED JOINTS;

EID: 39149102559 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-007-9349-7 Document Type: Article

Times cited : (65)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.