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Materials Science and Engineering: A

Volumn 407, Issue 1-2, 2005, Pages 36-44

Reliability of Sn-Ag-Sb lead-free solder joints

(4) Lee, Hwa Teng a Lin, Heng Sheng b Lee, Cheng Shyan a Chen, Po Wei a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Lead free solder; Low cycle fatigue; Reliability; Sn Ag Sb solder

Indexed keywords

ANTIMONY; COMPUTER SIMULATION; COPPER; CRACK INITIATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FRACTURE; INTERMETALLICS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN;

HOURGLASS-SHAPED SOLDER JOINT; LEAD-FREE SOLDER; LOW CYCLE FATIGUE;

TIN ALLOYS;

JOINT; SOLDER;

EID: 27144446762 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.07.049 Document Type: Article

Times cited : (100)

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