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Journal of Electronic Materials

Volumn 39, Issue 2, 2010, Pages 223-229

Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder

(6) Han, Y D a,b Jing, H Y a Nai, S M L c Xu, L Y a Tan, C M b,c Wei, J c

a TIANJIN UNIVERSITY (China)

b NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

Author keywords

Creep; Hardness; Lead free solder; Nanoindentation

Indexed keywords

CREEP BEHAVIORS; CREEP MECHANISM; CREEP STRAIN RATE; DEPTH SENSING INDENTATION; DISLOCATION CLIMB; DISLOCATION CORE; HARDNESS RESULT; HIGH TEMPERATURE; LEAD FREE SOLDERS; LEAD-FREE SOLDER; POWER-LAW RELATIONSHIP; SN-3.5AG; SN-AG-CU LEAD-FREE SOLDERS; STEADY-STATE CREEP; STRESS EXPONENTS; TEMPERATURE DEPENDENCE;

ACTIVATION ENERGY; CREEP; HARDNESS; LEAD; NANOINDENTATION; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TIN;

STRAIN RATE;

EID: 77951257866 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0970-5 Document Type: Article

Times cited : (64)

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