Effects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 12, 2009, Pages 1193-1199

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c   Sheng, Zhong ^a   Zeng, Guang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CE ADDITION; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; INTERMETALLIC PHASE; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MATRIX MICROSTRUCTURE; MECHANICAL STRENGTH; PROPERTIES AND MICROSTRUCTURES; SN-AG-CU; SN-AG-CU ALLOY; SN-PB ALLOYS; SNAGCU SOLDER; SOLDER INTERFACES; TRACE AMOUNTS;

ALLOYS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; METAL REFINING; MICROSTRUCTURE; PHASE INTERFACES; RARE EARTHS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS; TRACE ANALYSIS;

TIN;

EID: 70350336742     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-008-9850-7     Document Type: Article

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