Creep and fatigue behavior of SnAg solders with lanthanum doping

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 712-718

  Pei, Min ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Constitutive law; Creep; Lead free solder; Rare earth element (RE)

Indexed keywords

BRAZING; CREEP; CREEP TESTING; FATIGUE TESTING; LANTHANUM; LANTHANUM ALLOYS; LEAD; MATHEMATICAL MODELS; METALLIC COMPOUNDS; RARE EARTH ELEMENTS; SOLDERING ALLOYS; THERMAL AGING; WELDING; WELDS;

AGING BEHAVIORS; AGING TEMPERATURES; AGING TIME; CONSTITUTIVE LAW; CREEP BEHAVIORS; EXPERIMENTAL DATA; EXTENSIVE TESTING; FATIGUE BEHAVIOR; FATIGUE PERFORMANCE; FATIGUE-LIFE; LA DOPING; LANTHANUM DOPING; LEAD FREE SOLDER; LEAD-FREE SOLDER ALLOYS; MODEL PREDICTIONS; OPTIMAL DOPING; RARE EARTH ELEMENT (RE); RE DOPING; SOLDER ALLOYS; VISCO-PLASTIC MODELS;

CREEP RESISTANCE;

EID: 54849142500     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.922002     Document Type: Article

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