Microstructure evolution and mechanical properties of Sn-Ag based composite solder joints during isothermal aging

Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

Volumn 25, Issue 5, 2008, Pages 8-13

  Tai, Feng ^a   Guo, Fu ^a   Liu, Bin ^a   Shen, Hao ^a   Lei, Yongping ^a   Shi, Yaowu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite solder; Intermetallic compound; Isothermal aging; POSS

Indexed keywords

ACTIVATION ENERGY; BRAZING; COPPER; GROWTH KINETICS; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; OPTICAL MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS; WELDING;

AGING PROCESSES; COMPOSITE SOLDER; COMPOSITE SOLDERS; COPPER SUBSTRATES; ELECTRONIC MICROSCOPIES; INTERFACIAL LAYERS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND GROWTHS; INTERMETALLIC LAYERS; ISOTHERMAL AGING; MASS FRACTIONS; MICROSTRUCTURE EVOLUTIONS; OPTICAL-; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; POSS; SOLDER JOINTS;

TIN;

EID: 55149115228     PISSN: 10003851     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

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