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Volumn 420, Issue 1-2, 2006, Pages 39-46

Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing

Author keywords

Additive; Diffusion; Intermetallic compounds; Lead free solder; Thermodynamic

Indexed keywords

ADDITIVES; ANNEALING; COBALT; COMPOSITION EFFECTS; DIFFUSION; INTERMETALLICS; NICKEL; SOLDERING; THERMODYNAMICS; TIN ALLOYS;

ISOTHERMAL ANNEALING; LEAD-FREE SOLDER; THERMODYNAMIC INTERACTIONS;

SOLDERING ALLOYS;

ADDITIVES; ANNEALING; COBALT; COMPOSITION EFFECTS; DIFFUSION; INTERMETALLICS; NICKEL; SOLDERING; SOLDERING ALLOYS; THERMODYNAMICS; TIN ALLOYS;

EID: 33645537269 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2006.01.032 Document Type: Article

Times cited : (187)

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