A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1445-1450

  Ou, Shengquan ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODE SIDE; KINETIC ANALYSIS; MINIATURIZATION; V-GROOVE LINES;

ANODES; COMPUTATIONAL METHODS; GROWTH (MATERIALS); KINETIC THEORY; OPTIMIZATION; SOLDERED JOINTS; STRESSES; VLSI CIRCUITS;

ELECTROMIGRATION;

EID: 24644443404     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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2. Tu, K. N., Gusak, A. M., and Li, M., "Physics and Materials Challenges for Pb-free Solders," J. Appl. Phys., Vol. 93 (2003), pp. 1335.
3. The International Technology Roadmap for Semiconductor, SIA (2003).
4. Brandenburg, S. and Yeh, S., "Electromigration Studies of Flip Chip Bump Solder Joints," Proceedings of Surface Mount International Conference and Exhibition, SMI98, San Jose, CA, Aug. 1998, pp. 337-344.
5. Lee, T. Y., Tu, K. N., Kuo, S. M., and Frear, D. R., " Electromigration of Eutectic SnPb Solder Interconnects for Flip Chip Technology," J. Appl. Phys., Vol. 89 (2001), pp. 3189-3194.
6. Lee, T. Y., Tu, K. N., and Frear, D. R., "Electromigration of Eutectic SnPb and SnAgCu Flip Chip Solder Bumps and Under-bump-metallization, " J. Appl. Phys., Vol. 90 (2001), pp4502-4508.
7. Y. C. Hu, Y. L. Lin, C. R. Kao, and K. N. Tu, "Electromigration failure in flip chip solder joints due to rapid dissolution of Cu," J. Materials Research, 18 (2003), pp. 2544-2548.
8. J. W. Nah, K. W. Paik, J. O. Suh, and K. N. Tu, "Mechanism of electromigration induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints," J. Appl. Phys., 94 (2003), pp. 7560-7566.
9. H. Gan, W. J. Choi, and K. N. Tu, "Electromigration in flip chip solder joints and solder lines," JOM, 6 (2002), pp. 34-37.
10. K. Gan and K. N. Tu, "Effect of electromigration on intermetallic compound formation in Pb-free solder - Cu interfaces," 52nd Electronic Component & Technology Conference Proceedings, San Diego, CA (2002), pp. 1206-1212.
11. Gurov, K. P. and Gusak, A. M., " On the Theory of Phase Growth in the Diffusion Zone during Mutual Diffusion in an External Electric Field," Phys. Met. Metall., Vol. 52, No.4 (1981), pp75-81.
12. Blech, I.A. and Herring, C., "Stress Generation by Electromigration," Appl. Phys. Lett., Vol.29, No.3 (1976), pp131-133.