Effects of Ni particle addition on microstructure and properties of SnAg based composite solders

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 717-721

  Liu, Peng ^a   Guo, Fu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; ARSENIC COMPOUNDS; BRAZING; CHIP SCALE PACKAGES; CHLORINE COMPOUNDS; COPPER; COPPER ALLOYS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EUTECTICS; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; MELTING POINT; METALLIC COMPOUNDS; METALS; MICROELECTRONICS; MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; OPTICAL DESIGN; PHASE INTERFACES; REINFORCEMENT; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS; STRENGTH OF MATERIALS; SUBSTRATES; TECHNOLOGY; THERMOCHEMISTRY; TIN ALLOYS; TITANIUM COMPOUNDS; TITRATION; VOLUME FRACTION; WEIGHT CONTROL; WELDING;

CIRCULAR SHAPE; COMPOSITE SOLDERS; CU SUBSTRATES; ENVIRONMENTAL CONCERNS; EUTECTIC SOLDERING; FATIGUE PROPERTIES; IMC GROWTH; INTERMETALLIC COMPOUNDS; LEAD-BASED SOLDERS; LEAD-FREE SOLDERING; MICRO-ELECTRONIC PACKAGING; NI PARTICLES; NON-COMPOSITE; PACKAGING TECHNOLOGIES; PARTICLE ADDITIONS; PROCESSING PERFORMANCE; REINFORCEMENT PARTICLES; SINGLE-SHEAR LAP JOINTS; SOLDER ALLOYS; SOLDER INTERFACES; SOLDER JOINTS; SOLDER PASTES; SURFACE QUALITIES; TEMPERATURE APPLICATIONS; VOLUME PERCENT;

TIN;

EID: 50249130851     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342801     Document Type: Conference Paper

References (17)

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