Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder

Journal of Alloys and Compounds

Volumn 453, Issue 1-2, 2008, Pages 180-184

  Shi, Yaowu ^a   Tian, Jun ^a   Hao, Hu ^a   Xia, Zhidong ^a   Lei, Yongping ^a   Guo, Fu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Creep rupture life; Erbium; Lead free solder; Mechanical property; Microstructure; Rare earth; SnAgCu

Indexed keywords

RARE EARTH ELEMENTS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; TIN ALLOYS; WETTING;

CREEP RUPTURE LIFE; LEAD-FREE SOLDERS;

MICROSTRUCTURE;

EID: 40349114531     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.11.165     Document Type: Article

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