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Volumn 472, Issue 1-2, 2009, Pages 198-202

Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint

Author keywords

Lead free solder; Mechanical properties; Microstructure; Rare earth alloys and compounds

Indexed keywords

BRAZING; COPPER ALLOYS; CRACK PROPAGATION; CREEP; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; MICROSTRUCTURE; RARE EARTH ADDITIONS; RARE EARTH ELEMENTS; RARE EARTHS; SOLDERING ALLOYS; WELDING;

EID: 61449208110     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.04.044     Document Type: Article
Times cited : (56)

References (17)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.