|
Volumn 472, Issue 1-2, 2009, Pages 198-202
|
Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint
|
Author keywords
Lead free solder; Mechanical properties; Microstructure; Rare earth alloys and compounds
|
Indexed keywords
BRAZING;
COPPER ALLOYS;
CRACK PROPAGATION;
CREEP;
INTERMETALLICS;
LEAD;
LEAD COMPOUNDS;
MECHANICAL PROPERTIES;
MICROSTRUCTURE;
RARE EARTH ADDITIONS;
RARE EARTH ELEMENTS;
RARE EARTHS;
SOLDERING ALLOYS;
WELDING;
CONSTANT STRESS;
CREEP FATIGUES;
CREEP-FATIGUE DAMAGES;
FRACTURE PROCESS;
INTERMETALLIC COMPOUNDS;
LEAD-FREE SOLDER;
MECHANICAL CREEPS;
MICRO CRACKS;
PROPAGATION SITES;
RARE EARTH ALLOYS AND COMPOUNDS;
RE ELEMENTS;
SN-AG-CU SOLDERS;
SOLDER JOINTS;
STRAIN AMPLITUDES;
RARE EARTH ALLOYS;
|
EID: 61449208110
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.04.044 Document Type: Article |
Times cited : (56)
|
References (17)
|