Influence of the addition of indium on the mechanical creep of Sn-3.5%Ag alloy

Journal of Alloys and Compounds

Volumn 503, Issue 1, 2010, Pages 65-70

  Negm, S E ^a   Mady, H ^a   Bahgat, A A ^a  

^a Al Azhar University   (Egypt)

Author keywords

Creep; Microstructure; Sn Ag In; Soldering

Indexed keywords

AG-ALLOY; AG-IN ALLOYS; AS CAST ALLOY; AVERAGE VALUES; BEFORE AND AFTER; BINARY COMPOSITION; BINARY SYSTEMS; CONTROLLING MECHANISM; CREEP PROPERTIES; CREEP TESTS; MECHANICAL CREEP; METAL ADDITION; MICROHARDNESS TESTS; PB FREE SOLDERS; SELF-DIFFUSION; SN-3.5AG; SN-AG-IN; SOLDER ALLOYS; STEADY-STATE CREEP;

ACTIVATION ENERGY; CERIUM ALLOYS; CREEP; INDIUM; INDIUM ALLOYS; LEAD; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TERNARY SYSTEMS; TIN ALLOYS;

TIN;

EID: 77955309324     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.05.007     Document Type: Article

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