Creep behavior of SnAgCu solders with rare earth Ce doping

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 20, Issue 3, 2010, Pages 412-417

  ZHANG, Liang ^a   XUE, Song bai ^a   GAO, Li li ^a   ZENG, Guang ^a   CHEN, Yan ^b   YU, Sheng lin ^a,c   SHENG, Zhong ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

constitutive equations; creep behavior; rare earth Ce; SnAgCu solder

Indexed keywords

CE-DOPING; CONSTITUTIVE RELATIONS; CREEP BEHAVIOR; CREEP BEHAVIORS; CREEP CONSTITUTIVE EQUATIONS; CREEP STRAIN RATE; EXPERIMENTAL DATA; EXTENSIVE TESTING; MASS FRACTION; MELTING TEMPERATURES; MODEL CONSTANTS; NONLINEAR LEAST-SQUARES FITTING; SNAGCU ALLOYS; SNAGCU SOLDER; TENSILE CREEP BEHAVIOR;

CERIUM; CERIUM COMPOUNDS; CONSTITUTIVE EQUATIONS; CREEP; MECHANICAL PROPERTIES; RARE EARTH ALLOYS; RARE EARTHS; SOLDERING ALLOYS; STRAIN RATE;

CREEP RESISTANCE;

EID: 77950237369     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(09)60155-2     Document Type: Article

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